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  • title: Heat sink topology optimisation using a transient pseudo-3D thermofluid model for instantaneous chip cooling
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            Heat sink topology optimisation using a transient pseudo-3D thermofluid model for instantaneous chip cooling
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            Heat sink topology optimisation using a transient pseudo-3D thermofluid model for instantaneous chip cooling

            Jan 11, 2021

            Sprecher:innen

            TZ

            Tao Zeng

            Sprecher:in · 0 Follower:innen

            HW

            Hu Wang

            Sprecher:in · 0 Follower:innen

            MY

            Mengzhu Yang

            Sprecher:in · 0 Follower:innen

            Organisator

            WC
            WC

            WCCM-ECCOMAS Congress

            Konto · 74 Follower:innen

            Kategorien

            KI und Datenwissenschaft

            Kategorie · 10,8k Präsentationen

            Über WCCM-ECCOMAS Congress

            ECCOMAS is a scientific organization founded in 1992, grouping together European associations with interests in the development and applications of computational methods in applied sciences and technology. The mission of ECCOMAS is to promote joint efforts of European universities, research institutes and industries which are active in the broader field of numerical methods and computer simulation in Engineering and Applied Sciences (i.e. Computational: Solid and Structural Mechanics, Fluid Dynamics, Acoustics, Electromagnetics, Physics, Chemistry, Applied Mathematics, and Scientific Computing), to address critical societal and technological issues with particular emphasis on multidisciplinary applications and disseminate innovative research in the fields of ECCOMAS.

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